XRF Testing | IC Test
XRF Testing/XRF Analysis (RoHS Testing)
RoHS compliance requirements
Retronix use the – Fischer XDAL SDD System for XRF Analysis.
The implementation of RoHS compliance requirements has caused some major impacts on the supply chain. Some manufacturers did not change their part number when parts were transferred from SnPb alloy to Lead Free. This means that a grey area exists in what alloy is used on the terminations of some parts therefore XRF Testing/XRF Analysis is required to determine if they are leaded or lead free.
Our XRF Testing/XRF analysis facility allows a non-destructive method to determine what alloy a termination consists of. All devices can be XRF tested including BGA’s, QFP’s and TSOPs, to Capacitors, resistors and connectors. The test consists of analysing the composition & a termination using a XRF test, to determine if it is lead free or leaded.
After the parts go through XRF test, we will also supply a certificate to show the alloy composition.
For components recovered by Retronix we will confirm the alloy of the termination and confirm with the customer if they are to be converted.
As part of our PCB repair business, Retronix Ltd provides an alloy conversion service. This allows us to convert the alloy of the terminations or simply refresh the existing alloy.
XRF Testing/XRF Analysis determines the metal composition of a termination, e.g. a QFP lead, or a BGA sphere. This method is commonly used for lead free testing, to identify ICs as lead free or not.