PCB Modelling
Retronix offer a range of unique services for anyone having to modify or build a PCB in order to measure specific data, eg. from a single component. Applications for this include designing in a new component & failure analysis, among many others. Retronix offers advantages in terms of speed of result and cost reduction, but the main advantage is we can do all this using processes that pose much less risk to the component & PCB, so accuracy of data is better. Also we eliminate mechanical connections, which can lead to signal loss, also improving data accuracy.
Retronix, for 27 years, have specialised in the component and PCB modification for the high reliability electronics industry (Eg. Aerospace,Defence) to provide solutions for Obsolescence for example. This has led us to develop a set of processes which are unique, and work brilliantly in PCB modelling.
Following is an example of how the unique services work together for an innovative solutions, followed by a description of some of them –
| IC REMOVAL - Removing IC's from PCB's can lead to damage, or software corruption. Retronix have a number of safer techniques including bottom heat removal which ensures the IC subject to minimal heat. | |
| BGA REBALLING - We use a laser process to replace balls on a BGA which eliminates any reflow cycle, thereby avoiding heat damage. | |
| SOLDER STACKING - Where height has to be added, we change a gripper socket to a column of solder, instantly created, solderable, a fraction of the cost and eliminating mechanical connections, replacing them with more reliable solder connections. | |
| LOW TEMP SOLDER - We use low temperature to assemble. This doesn't have the long term robustness of normal solder, but that isn't needed in prototyping/R&D. It avoids potential heat damage. | |
| IN HOUSE TEST - We have in house IC Test, to ensure no damaged component is used. |
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