REBALLING SERVICE

For over three decades, Retronix has provided top-notch Reballing services to the High Reliability sectors, making us specialists in reballing methodologies and applications. Our expertise in reballing process excellence stems from refining our techniques to consistently achieve outstanding outcomes across various electronic component packages.

Each industry and organization has unique internal guidelines for determining the appropriate rework processes and methods. Retronix caters to its clients’ specific needs by providing exceptional Laser Reballing as well as IPC Certified Reflow Reballing services. Although Laser Reballing offers reflow-free reballing, both methods have their merits, with Reflow Reballing being approved and chosen by numerous High Reliability organizations. Reballing entails the removal and replacement of solder balls on a Ball Grid Array (BGA) component, guaranteeing reliable electrical connections and avoiding joint failures.

Why Reball?

  • Convert from Pb Free (SAC 305) to Pb or Vice Versa
  • Recovery of High Value Silicon
  • Handling Damage
  • Oxidation
  • Improve the Coefficient Thermal Expansion Mismatch (CTE) on LCC’s and LGA’s
Rebaling BGA

LASER REBALLING

NO REFLOW CYCLES

AUTOMATED PROCESS

APPROVALS FROM LEADING TIER 1 OEM’S AND EMS PROVIDERS

Reflow Reballing Service

REBALLING

✓ Work to JEDEC & IPC Standards

Time Tested Results

APPROVALS FROM LEADING TIER 1 OEM’S AND EMS PROVIDERS

Application Specific Reballing

Application Specific Solutions

Customised Reballing Solutions

Mitigate CTE Issues

APPROVALS FROM LEADING TIER 1 OEM’S AND EMS PROVIDERS

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