Robotic Hot Solder Dip / Robotic Soldering / Alloy Conversion / Retinning

Alloy conversion & automated retinning

Automated Alloy Conversion & Re-Tinning

Video showing Tin Whiskers

Automated Alloy Conversion/ Robotic Hot Solder Dip


Full BOM Conversion :

Retronix provides automated component re-tinning and chemical stripping of the Pb free or SnPb alloy coating. Our internal processes are optimised by component type, and are used to avoid solderability issues and convert lead free to lead alloy to mitigate tin whisker issues.

For all components with leads, QFP, TSOP, MSOP, PTH, sockets and axials, we offer a retinning process fully compliant with ANSI/GEIA-STD-0006. We can perform Pb to Pb free, Pb free to SnPb and re-tinning of existing alloys.

Our fully automated equipment ensures our processes do not expose the components to excessive heat, time or abrasion, are completely IC device safe and meets the reliability program requirements of ANSI/GEIA-STD-0006.

Applications Include :

  • Convert any component from Lead Free to Lead Solder
  • Convert any component from Lead to Lead Free Solder
  • Double dip tinning for more relaible solder joints in harsh environments; eg. where heat and vibration exist. Double dip tinning suppresses oxidisation short term and therefore produces a much stronger solder joint during assembly.
  • Remove Gold Finish from component terminations to avoid gold embrittlement issues.

Watch a video that shows our Automated System in Action :

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