ROBOTIC HOT SOLDER DIP

The Retronix Robotic Hot Solder Dip process has several applications including, converting alloy on devices, refreshing oxidised alloy, tin whisker mitigation, and double-dip tinning for solder joints operating in harsh environments. The re-tinning or refreshing of contacts is of particular interest in the case of high-priced or obsolete components that are heavily oxidised as a result of overlaying.

The Retronix process can be carried out both manually and fully automatically according to GEIA-STD-0006. The proof of successful processing is confirmed by our in-house testing suite. Our top-of-the-line service is the go-to choice for global High Reliability organisations.

Chip Capacitors Tinning

Micro Device Tinning

Mitigate Tin Whiskers

AUTOMATED PROCESS

APPROVALS FROM LEADING TIER 1 OEM’S AND EMS PROVIDERS

Alloy Conversion Process

Alloy Conversion

Convert from Lead to Lead Free and vice versa

AUTOMATED PROCESS

SAC305, Sn63Pb37 and more

Tin Whisker Mitigation

Tin Whisker Mitigation

Convert LEAD FREE TO LEAD

AUTOMATED PROCESS

APPROVALS FROM DEFENSE & SPACE COMPANIES

Alloy Refresh

ALLOY REFRESH

Automated Retinning

Double Dip Tinning

Solderability Checks

Gold-Embrittement-Option-01

GOLD EMBRITTLEMENT

De-GOLD Devices

Double Dip Tinning

Solderability Checks

Contact Us For More Information