Improved Results in R&D



“Retronix’s unique services have significantly improved results from my R&D tests in three areas – accuracy of result, speed & cost”.

Yacov Duszly – Research Engineer – Western Digital Sandisk


Retronix offers a suite of UNIQUE SERVICES in areas such as System Design and IC Test among others, designed to improve the accuracy of data from tests.


  • IC Removal from underneath avoids a reflow cycle on the IC, allowing the same BGA to be used on the original PCB.
  • Air knife removes old solder with no reflow or operator error in a controlled ‘no touch’ process.
  • BGA is reballed using a laser – no reflow
  • The interposer PCB can be fitted with columns instead of spheres to increase stand-off height and lift assemblies above adjacent components.
  • Retronix has various mechanical and electrical tests available for both individual ICs and PCBs to verify operation.

Current Method:

  • The BGA to be tested is cut from a PCB. Then the remaining PCB base material is milled from the BGA.
  • The remaining solder is removed using braid and a soldering iron – this is to avoid heat cycles damaging either the software or the hardware of the BGA.
  • On an identical PCB the same BGA is removed using hot air, and discarded. This PCB then becomes the host for the experiment.
  • It is preferable to use the BGA on the original PCB but this is too risky due to multiple heat cycles.
  • 2 Grypper sockets (in blue) are then soldered to the main PCB and the interposer PCB.
  • The interposer PCB has spheres attached to the bottom side so it fits in the bottom gripper socket.
  • Then the whole thing comes together to make the top BGA connect with the PCB.
  • This however has 2 mechanical and 2 solder connections, which could cause a loss of signal.
  • Also the BGA and PCB have had 2 full reflow cycles.

Retronix Method:

  • BGA removed from original PCB using heat from underneath. This is not a reflow cycle so BGA not compromised.
  • This allows the original BGA to be used on the original PCB, which is preferred.
  • Remaining solder removed using an air knife with no abrasion.
  • BGA reballed using laser pulse creating zero heat.
  • Solder Columns attached to the interposer PCB to increase height stand off
  • BGA soldered to interposer PCB using low temperature solder, no reflow cycle. Interposer PCB soldered to original PCB using the same process.
  • Connection achieved using no gripper sockets or mechanical connections, only solder connections so signal integrity much better.
  • No reflow cycles used in entire process.


For more information contact :

Mr Rob Ronan (UK Sales & Support Manager) –
Use our Contact us form – Click Here
Call us on : +44 (0) 1236 433 345


Mr Gary Moffat (Sales Director) –
Use our Contact us form – Click Here
Call us on : +44 (0) 1236 433 345