Solder balls attached to component leads using the Retronix laser process.
Do you have issues with the amount of solder you are getting on component leads after SMT reflow on mixed technology PCBs?
Retronix have a unique way to ensure you get the solder quantity you need on these leads without the risk and time taken on a second stage touch up.
Solder balls are attached to the leads using our laser process which does not introduce an extra reflow to the component.
We are happy to carry out free of charge samples to assist you to prove the process and the benefits to your company.
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