Retronix has a top-of-the-line system that sets the benchmark for an advanced and reliable reballing service.
Reballing without reflow cycles, such as Laser Reballing, is an innovative technique that offers numerous benefits for High Reliability applications. This method eliminates the need for reflow, reducing potential damage to the Ball Grid Array (BGA) components and surrounding areas. By minimizing thermal stress, it preserves the integrity of the components and ensures a longer lifespan. Furthermore, this reflow-free reballing process enhances the quality of electrical connections and helps prevent joint failures, making it a preferred choice for clients seeking top-notch reballing services that cater to their specific needs and requirements.
Retronix is unique in providing the exclusive Laser Reballing service, eliminating the requirement for an extra reflow, safeguarding the device. Retronix boasts endorsements from esteemed clients like Leonardo, BAE Systems, Martin Baker Air Craft Company and numerous other high-reliability companies. These organizations recognize the importance of minimizing component reflow and understand that employing a laser for reballing is the sole method to ensure the prevention of long-term damage to the silicon.
FURTHER INFORMATION IS AVAILABLE
Our Laser Reballing brochure provides further details on our specialised service which we have been delivering to the High Reliability industries for 30 years.
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