LASER REBALLING SERVICE

Retronix has a top-of-the-line system that sets the benchmark for an advanced and reliable reballing service.

Reballing without reflow cycles, such as Laser Reballing, is an innovative technique that offers numerous benefits for High Reliability applications. This method eliminates the need for reflow, reducing potential damage to the Ball Grid Array (BGA) components and surrounding areas. By minimizing thermal stress, it preserves the integrity of the components and ensures a longer lifespan. Furthermore, this reflow-free reballing process enhances the quality of electrical connections and helps prevent joint failures, making it a preferred choice for clients seeking top-notch reballing services that cater to their specific needs and requirements.

Retronix is unique in providing the exclusive Laser Reballing service, eliminating the requirement for an extra reflow, safeguarding the device. Retronix boasts endorsements from esteemed clients like LeonardoBAE SystemsMartin Baker Air Craft Company and numerous other high-reliability companies. These organizations recognize the importance of minimizing component reflow and understand that employing a laser for reballing is the sole method to ensure the prevention of long-term damage to the silicon.

REBALLING PROCEDURE

  • 100% quality pre-inspection on all parts. 
  • All parts are entered into bespoke factory management system and then pre-baked before reball ensuring that the correct pre-baking conditions are followed.
  • Old spheres, or remaining solder, is removed using the non-contact de-soldering system.
  • Before commencing with the full batch, an initial 5 part sample is completed and signed off as passed by QC operator.
  • Automated Mechanical Checks are performed on reballed parts
  • Quality Control – Final Inspection
  • Passed parts – Post baked, vacuum sealed then packed and shipped.

FEATURES & BENEFITS

  • Single-step solder ball placement and reflow.
  • No special tooling required
  • No additional reflow required
  • Solder-ball diameter from – 250µm to 760µm
  • High solder alloy flexibility – Eutectic SnPb, High-lead SnPb, Lead-free SnAg, SnAgCu, etc.
  • In-line capability & High throughput
  • High accuracy axis system
  • Automated fiducial alignment
  • Ball rework and repair capability
  • 3D Camera – Height auto measurement
  • 2D bump-inspection systems
  • Integrated laser power sensor
  • Solder rework & reballing station
  • Automatic handling/robot system
  • Tray Unit

APPLICATIONS

  • HDD (HGA, HSA, Hook-Up)
  • BGAs, CLCC’s, CSPs
  • 3D packaging
  • 4- to 12-inch wafers
  • Repair/rework of BGA-like packages
  • Optoelectronics/Micro-optics
  • MEMS
  • Camera modules
  • Wafer bumping

FURTHER INFORMATION IS AVAILABLE 

Our Laser Reballing brochure provides further details on our specialised service which we have been delivering to the High Reliability industries for 30 years.

Laser Reballing Brochure download

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