Retronix Blog

Dec 21, 2017

Investigating IC failures, or want to understand how it works?

Often in R&D situations a BGA has to be removed from a PCB then reballed to be either re-used or tested for investigating IC failures, or wanting to understand how it works.

It’s vital that during this reballing operation the BGA is NOT damaged in any way.

Retronix reball their BGA’s using a laser reball system that puts no thermal stress into the BGA, and is the only process that meets the IC manufacturer’s T&C’s on use.


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