Find Us @
MENU
MENU
Home
Services
Automated Alloy Conversion / Re-Tin
Convert Lead ICs to Lead Free
Tin Whisker Mitigation
Gold Embrittlement
Convert Lead Free ICs to Leaded
Full BOM Conversion for OEM's / CEM's
IC Suppliers enter the High Reliability Market
BGA Laser Reballing
BGA Reballing
Application Specific Balling and Reballing
IC Tests
Visual Inspection
X-Ray Fluorescence (XRF Test)
XRAY Inspection
Solderability Test
Electrical Testing
Key Functional Testing
Flash Memory Test
Decapsulation
Ionic Testing
Extreme Temperature Test
BGA Recovery
QFP Recovery
PCB Services
PCB Obsolescence Services
IC Repair
PCB Modelling
Sectors
Defence, Medical & Aerospace
Automotive Electronics
IC Supplier
OEM/CEM PCB Assembler
Service Repair Company
Electronic Material Recycler
Quality
Quality Policy
Retronix fully upgrade the factory with barcode technology & a factory management system.
Testimonials
Retronix Customer Satisfaction Survey
Our Affiliations
Company
About Retronix
Our Team
Media
Flyers
Videos
Automated Alloy Conversion for OEM-CEM
IC Suppliers gain competitive edge
Laser BGA Reballing
Retronix Electrical Testing
Retronix Safe IC Recovery
Automated Lead Straightening | IC Repair
Automated Mechanical Inspection for IC's
Robotic Hot Solder Dip (Full BOM)
Retronix Blog
Newsletters
Partners Login
Contact
Contact Us
Frequently Asked Questions
Our Locations
Quote Form
Dashboard
