Various studies have been conducted on this area including one by NASA, exactly how and why tin whiskers grow is not completely understood, it was first identified within terrestrial electronics, but these whiskers are known to grow rapidly out of pure tin in the weightlessness, vacuum and temperature extremes of space, some of the other reasons include –

  • Stress in the plating
  • Micro fractures
  • Thin plating
  • Intermettalic compound formation
  • External Stress, vibrations, shock
  • Thermal Imbalance (CTE  – Coefficient Thermal Expansion)

A huge resource of information, case studies and extensive investigations of Tin Whiskers can be found on the NASA NEPP website – click here, as seen with some photo examples here.

Tin Whisker Mitigation

WHAT IS THE SOLUTION?

It is well documented that introducing lead in the assemblies mitigates the growth of tin whiskers.

Therefore the Retronix solution is to convert the pure tin alloy on the termination to one with lead content, using a unique process that meets the stringent standards of high reliability industries.

  • Meets the GEIA-STD-0006
  • Fully automated and repeatable.
  • One of the only few companies in the world to offer a full bill of material conversion.
  • Mechanical Checks, Alloy Composition check using XRF, inhouse verification process, and bespoke factory system to provide fully traceable reports.

FURTHER INFORMATION IS AVAILABLE 

Our Full BOM tinning brochure provides further details on our specialised service which can mitigate tin whiskers, convert from RoHS to Non-RoHS and vice versa.

Robotic Hot Solder Dip Brochure

Contact Us For More Information