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Single / Multiple Component Changes / Rework
Retronix have the capability and expertise to offer all types of component changes, from 0201 discretes, high pin count FPQFP, SM/ Thru Hole Connectors and Components including BGA/uBGA. (Lead Free/63-37/Ceramic/Column Grid Array) Using a broad range of the most up to date rework equipment, Retronix have a wealth of experience in all types of technology in use today. We include 3D X-Ray inspection as a 100% quality assurance for BGA Rework, as well as an independent X-Ray service.
From low to high volume batch mis-loads, engineering changes and upgrades, Retronix offer the most cost effective solution available.

 

 
Component Changes 3D X-Ray Ersascope Inspection

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