Reclaim High Value BGA's from obsolete, damaged or old revision PCB's
IC rescue - Retronix's 8 step BGA recovery process
BGA Recovery
Each PCB is prebaked to JEDEC standard to remove moisture.
Components are removed using a process that sacrifices the PCB in order to protect the IC, and avoids normal reflow cycles on the IC. Our thermal cycle is much shorter (under 30 seconds) and at a far lower temperature.
Solder is removed in a controlled process, which avoids reflow temperature to the component and any abrasive process.
The BGA is reballed using a laser to attach each sphere individually. No heat is generated during this process.
Device is then washed with solvent and rinsed. Alternative process is to batch clean.
Device is then mechanically tested.
An optional Electrical Test (Curve Trace) also available.
Device is rebaked and vacuum packed for shipping.
High Value IC Recovery
Every day millions of dollars of brand new components are scrapped by manufacturers because they are attached to faulty PCBs. If these components could be safely removed, and the BGAs Reballed, these companies would save huge amounts of money in recovered scrap, provide much needed “allocated” components and also reduce the amount and cost of landfill. An added bonus is that it would also seriously damage the counterfeit industry, whose raw material supply would be reduced.
Is the chip you want to re-use the reason that the PCB failed?
It’s been well proven over time that very few of these failed PCBs are caused by bad silicon. At least 70% of scrap is created by solder paste issues alone. Retronix also puts every component through a rigorous test process to eliminate electrical and mechanical failures.
What if the component is damaged during removal or refurbishment?
Retronix offers the only safe IC recovery called IC Rescue process on the market. We carry out BGA reballing using no reflow cycles and no abrasive processes – and each part of our process is fully controlled and repeatable. Retronix laser BGA reballing localises and minimises the heat dissipated into the BGA package.