REBALLING SERVICE
Reballing services play a crucial role in the lifecycle of electronic components, particularly for Original Equipment Manufacturers (OEMs) and their Electronics Manufacturing Services (EMS) partners. The process involves the careful removal and replacement of solder balls on Ball Grid Array (BGA) packages, a task that requires precision and expertise.
Each industry and organization has unique internal guidelines for determining the appropriate rework processes and methods. Retronix caters to its clients’ specific needs by providing exceptional Laser Reballing as well as IPC Certified Reflow Reballing services. Although Laser Reballing offers reflow-free reballing, both methods have their merits, with Reflow Reballing being approved and chosen by numerous High Reliability organizations.
Why Reball?
- Convert from Pb Free (SAC 305) to Pb or vice versa
- Recondition recovered high value components for reuse
- Handling Damage
- Oxidation
- Improve the Coefficient Thermal Expansion Mismatch (CTE) on LCC’s and LGA’s
Technical Advantages
Compatibility Assurance: Reballing services enable the conversion of components from lead-free to lead-based solder balls and vice versa, ensuring compatibility with different manufacturing standards and regulations. This flexibility is essential for companies operating in various global markets with differing environmental and safety standards.
Thermal Stress Reduction: The reballing process, when performed correctly, minimizes thermal stress on the component. This is especially important for sensitive devices where excessive heat during soldering could damage the component or alter its performance.
Oxidation: Over time, solder balls can oxidize, leading to poor solderability and potentially compromising the electrical connection between the component and the circuit board. Reballing involves the removal of these oxidized solder balls and the application of new ones, which can significantly enhance the quality of these connections
Practical Benefits
Cost Efficiency: Reballing offers a cost-effective solution to extend the life of electronic components. Instead of replacing an entire circuit board or component due to faulty or aged solder balls, reballing allows for targeted repairs. This can significantly reduce waste and save on the costs of sourcing new parts.
Sustainability: From an environmental standpoint, reballing aligns with sustainability goals by promoting the reuse of components. By repairing and reusing existing BGAs, companies can minimize e-waste and contribute to more sustainable manufacturing practices.
Reliability Improvement: Properly conducted reballing can enhance the reliability of electronic components. Replacing worn, cracked, or otherwise compromised solder balls helps prevent future failures, ensuring the longevity and performance of the device.
LASER REBALLING
✓ NO REFLOW CYCLES
✓ AUTOMATED PROCESS
✓ APPROVALS FROM LEADING TIER 1 OEM’S AND EMS PROVIDERS
REBALLING
✓ Work to JEDEC & IPC Standards
✓ Time Tested Results
✓ APPROVALS FROM LEADING TIER 1 OEM’S AND EMS PROVIDERS
Application Specific Solutions
✓ Customised Reballing Solutions
✓ Mitigate CTE Issues
✓ APPROVALS FROM LEADING TIER 1 OEM’S AND EMS PROVIDERS
