Retronix News – Introducing the benchmark in Laser Reballing
Retronix sets a new benchmark with the introduction of the most advanced and reliable solder ball placement process.
RETRONIX INTRODUCE THE NEW BENCHMARK FOR LASER BGA REBALLING
Retronix have installed a new top of the line system which will set a new benchmark for an advanced and reliable solder ball placement. This new system provides an exceptional solution for BGA Reballing and Repair.
Reproducible solder bumping technology for packaging optoelectronic devices, MEMS, sensors, BGA’s, CLCC’s, CSP’s, Flip Chips and many more. Solder ball reflow is performed by a laser system using an infrared wavelength. All components of the system are integrated into a single cabinet.
Gary Moffat (R) – Sales Director
“Retronix are the only company to offer Laser Reballing, mitigating the need for an additional reflow thus protecting the device.
With the introduction of the latest laser technology this gives Retronix the ability to laser high melt solder balls (HMP) down to 250 microns as well as plastic and copper cored solder balls.
Retronix are the only company with approvals from such customer as Leonardo, BAE, Meggit Avionics and Martin Baker Air Craft Company and many more high reliability companies are realising the need to minimise the amount of reflows you give any single component therefore using a laser to perform the reballing is the only way to guarantee that there is no long term damage to the silicon. “
Tony Boswell – Managing Director, Toni Riemer – PacTech Representative, Gary Moffat – Sales Director
Tony Boswell – Managing Director | Retronix , Brian Loye – Scottish Enterprise
“In the last 3 months Retronix have invested 500k in the latest and greatest technology ranging from the latest PacTech laser reballing system as well as a new XRF analysis system which will compliment our current capabilities as well as help increase our capacity.” – Tony
KNOW MORE DETAILS ABOUT THE PROCESS BY CLICKING HERE
Images courtesy of PacTech