Solderability Test | IC Test

Solderability testing

Solderability Test

Make Sure IC’s do not have Solderability Issues in the Manufacturing Process

Is the component re-solderable?

Solderability testing verifies a component is re-solderable. In line with JEDEC standards, we use our Solderability test to ensure that parts will not have Solderability issues in the manufacturing process.

Retronix can also offer a 3rd party arbitration service, to help resolve any disputes or concerns between suppliers.

A great tool for assuring that any device that has gone through the tinning process has been successful. The Solderability Test measures the vertical force of buoyancy and surface tension of a fluxed component being immersed in molten solder.


The following is measured using our Solderability Test –

Time to Zero (Tb) The time the wetting curve takes to re-cross the zero line.
Time to Buoyancy (Ta) The time the wetting curve takes to re-cross the buoyancy line.
Time to 2/3 Fmax (T2/3) The time in seconds it takes for the force to reach 2/3 the maximum force.
Force at Time 1 + 2 Measuring the force at predetermined points in the process.
Wetting Angle at Time 1 + 2 Measuring the angle of the dip at a predetermined time during the process.

IC Test - Solderability Test

Advantages of using a Solderability Test :

1) Gurantees a stable electrical contact as a component that passes the Solderability Test shows reliable contact with a good uniform bond.

2) Using components with a good Solderability, the temperature used on the solder can be lowered, which can prevent damage in components.

3) Passing parts only need to be at the soldering temperatures for a short time period, this can reduce the risk of damaging heat sensitive components.

4) Solderability can save costs, it is much easier and less costly to prevent poorly soldered parts from reaching production.


Are you interested to know more, or would like to get your batch of components tested? – Click Here to Contact Us