Retronix - OEM Secrets

Retronix can test your components before you buy and can also offer alloy conversion if you cannot find your part in the specified alloy. We can also rectify many issues with components, eg. older components being oxidised.

Retronix-OEMSecrets

Laser Reballing

Automated Alloy Conversion

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SUITE OF TEST SERVICES –


All Tests can be done with a turn around time of 7-10 Days.

Flash Memory Test

FLASH MEMORY TEST / MEMORY PROGRAMMING:

With recent investment, Retronix can check for counterfeit programmable components. Using this tool, we can easily check device ID codes and confirm if your devices are BLANK or already programmed.

Already programmed FLASH parts can be erased back to factory default settings. Enquire for more information.


Heated Solvent Test

HEATED SOLVENT TEST:

A more effective method of revealing occurrences of resurfacing. This process includes suspending a sample component in a solution submerging half of the component. As the component remains in the solution for an extended period of time, any resurfacing or remarking on the submerged end will be removed while the portion remaining above the surface will remain unaffected.


Ionic Testing

IONIC TESTING:

Ionic contamination testing is required as ionic residues remaining from both the PCB manufacturing and the soldering process may affect the reliability of the finished assembly.


Key Function Test

KEY FUNCTION TEST:

Some devices may need to be tested by creating a circuit to ensure that they are operating as expected. With the aid of the component datasheet, Retronix can create a circuit and an IC Test for your device to check the key aspects of the device. For example, recovered MOSFETs can be tested to confirm that they still meet the manufacturer’s specifications.


Blacktoppping

PERMANENCY MARKING / BLACKTOPPING :

Authenticate the chip top surface and marking. Refurbished electronic components usually have been sanded to remove the original marking, and then blacktopped – covered with a black material to hide the evidence of Sanding.


Solderability Test

SOLDERABILITY TEST:

Our solderability test verifies whether a component is re-solderable or not and if it is ready to be placed onto your PCBs for reflow. If not, Retronix can strip the terminations and re-tin to the specified alloy if required.


Visual Inspection

VISUAL INSPECTION:

Visual inspection is an effective component testing method. By utilising optical inspection and visual inspection techniques, Retronix can confirm that your recovered components are in good condition. We will inspect for damage which may have occurred while they were on the PCBs and in some cases fix these defects.


XRF Analysis

XRF TESTING / XRF ANALYSIS:

Our XRF analysis facility provides a non-destructive method to determine what alloy a termination consists of. Once recovered, Retronix can determine what alloy is on the device terminations. Once reported to you, we can then convert to a different alloy if desired.


Upscaling

EXTREME TEMPERATURE TEST / UPSCALING:

Temperature extremes can significantly alter the mechanical and electrical properties of a component, such as brittleness of ICs, electrical conductivity and frequencies.


CURVE TRACE TEST

ELECTRICAL TESTING (CURVE TRACE):

The BEST (BGA & Electrical Silicon Test) is an electrical component test used to check the electrical parameters of every pin to pin e.g. current, voltage, diode resistivity, and silicon connectivity. This is a very strong tool which allows Retronix to confirm that the recovered devices are in good working condition. A Retronix Certificate will be published for your recovered components to show the results of our tests.


Decap

DECAPSULATION TEST:

Retronix can de-cap your IC and check for a range of visual indicators to help authenticate the originality of the device. We can also check for IC damage at high optical magnifications as the potential cause for test failures.


REQUEST FOR QUOTE –


eg. AM3352BZCE30
Upto 5 MB
Upto 5 MB
(Additional Information to get an accurate quote)