Micro Coil Springs
Current aerospace avionic designs routinely use integrated circuits packaged in BGA format. Unfortunately, the BGA package trades the compliance of leads for the quantity of noncompliant solder balls, which under thermal cyclic loading, severely limits the life of the solder joints.
One approach to overcome this limitation was to replace the noncompliant balls with more compliant solder columns.
However for temperature extremes and vibration a more robust and reliable solution was sought by NASA.
A long-term human presence in space without the benefit of resupply will require confidence levels not previously required. Due to this and existing reliability data on columns, NASA started investigating other potential flexible interconnects to improve the thermal reliability of ceramic area array packages. Preliminary assembly experiments with springs of various configurations were conducted. As a result of these preliminary experiments, a micro coil spring (MCS) was chosen and introduced into the test program.
The MCSs provide ample flexibility to withstand the shear forces resulting from the CTE mismatch and are much more robust from a handling perspective than high lead columns.
- Reduced electrical failures due to connection breaks caused by thermal stress
- >10,00 thermal cycles without failures
Robust, Rugged & Tough
- Resilient spring interconnect returns to home position
- High tolerance for temperature extremes, thermal cycling and vibration
- Improved three-dimensional flexibility versus traditional solder columns
- Absorbs CTE (Coefficient of Thermal Expansion) mismatch between ceramic substrated and FR4/Polyimide PC Boards
Retronix can now fit these Micro Coil Springs in our UK facility.
Contact us or call us on +44 (0) 1236 433 345