Retronix Solder Stacking as a lower cost alternative to Column Grid Arrays


Solder Stacking

 

Retronix offer a wide range of CGA options that offer stronger BGA connections and help with Co-efficient of Thermal Expansion (CTE) issues.

  • “Solder Columns are 10x times more reliable than single ball attach when attaching large size IC packages to PCB’s operating in Harsh Environments.”
  • “Solder Columns are flexible and absorb CTE mismatch, thereby lengthening the life of the circuit.”

 

  • High Melting Point (HMP) spheres reball process ensures minimum stand-off
  • Column instantly assembled from HMP spheres
  • Solder connection to IC, as it’s HMP, will never reflow again.
  • Available in different widths and sizes
  • Improved mechanical integrity over a wide operating temperature range
  • Can be used for high temperature applications

Other Column options :

Attach lower cost Pb90/Sn10 plain columns :


Attach Micro-Coil Springs

Attach columns with Copper Wrapping –


Attach S-Leads


Mr Rob Ronan (UK Sales & Support Manager) – rob.ronan@retronix.com
Use our Contact us form – Click Here
Call us on : +44 (0) 1236 433 345

 

Mr Gary Moffat (Sales Director) – gary.moffat@retronix.com
Use our Contact us form – Click Here
Call us on : +44 (0) 1236 433 345