Improved Results in R&D
“Retronix’s unique services have significantly improved results from my R&D tests in three areas – accuracy of result, speed & cost”.
Yacov Duszly – Research Engineer – Western Digital Sandisk
Retronix offers a suite of UNIQUE SERVICES in areas such as System Design and IC Test among others, designed to improve the accuracy of data from tests.
- IC Removal from underneath avoids a reflow cycle on the IC, allowing the same BGA to be used on the original PCB.
- Air knife removes old solder with no reflow or operator error in a controlled ‘no touch’ process.
- BGA is reballed using a laser – no reflow
- The interposer PCB can be fitted with columns instead of spheres to increase stand-off height and lift assemblies above adjacent components.
- Retronix has various mechanical and electrical tests available for both individual ICs and PCBs to verify operation.
- The BGA to be tested is cut from a PCB. Then the remaining PCB base material is milled from the BGA.
- The remaining solder is removed using braid and a soldering iron – this is to avoid heat cycles damaging either the software or the hardware of the BGA.
- On an identical PCB the same BGA is removed using hot air, and discarded. This PCB then becomes the host for the experiment.
- It is preferable to use the BGA on the original PCB but this is too risky due to multiple heat cycles.
- 2 Grypper sockets (in blue) are then soldered to the main PCB and the interposer PCB.
- The interposer PCB has spheres attached to the bottom side so it fits in the bottom gripper socket.
- Then the whole thing comes together to make the top BGA connect with the PCB.
- This however has 2 mechanical and 2 solder connections, which could cause a loss of signal.
- Also the BGA and PCB have had 2 full reflow cycles.
- BGA removed from original PCB using heat from underneath. This is not a reflow cycle so BGA not compromised.
- This allows the original BGA to be used on the original PCB, which is preferred.
- Remaining solder removed using an air knife with no abrasion.
- BGA reballed using laser pulse creating zero heat.
- Solder Columns attached to the interposer PCB to increase height stand off
- BGA soldered to interposer PCB using low temperature solder, no reflow cycle. Interposer PCB soldered to original PCB using the same process.
- Connection achieved using no gripper sockets or mechanical connections, only solder connections so signal integrity much better.
- No reflow cycles used in entire process.