Gold Embrittlement
Gold Embrittlement Solution
Gold Embrittlement Solution
What is the Problem?
– When components with gold plated terminations are soldered to a PCB, the gold dissipates into the solder joint, which can cause issues, namely gold embrittlement & voiding in the solder joints
– This can cause early life failure in the solder joints
Retronix Solution
The solution is to remove the gold from the termination, using our alloy conversion process
- Meets ANSI/GEIA-STD-0006
- Fully automated and repeatable
- Can be used for most SMT & thru hole components
- ICOS, XRF & Solderability testing available inhouse for verification
For more information for solutions on Gold Embrittlement please contact us by clicking here – Contact page